Berichte
The European Semiconductor Manufacturing Company (ESMC) is continuing its journey towards operational readiness and is inviting companies from across Europe to become part of its growing supplier ecosystem. As preparations for one of Europe’s most advanced semiconductor manufacturing facilities continue, ESMC is hosting its second Supplier Connection Day in Dresden, Germany, offering businesses the opportunity to present their expertise directly to ESMC procurement and technical teams.
Registration for the event is open from 20 July to 10 August 2026 via the official ESMC website and LinkedIn channel.
The Supplier Connection Day is designed to connect ESMC with experienced service providers capable of supporting the construction, operation and long-term success of its semiconductor fabrication plant.
ESMC is looking for qualified partners across a broad range of service areas, including:
To register please visit the ESMC Website (https://www.esmc.eu/en/index.html or https://zh.surveymonkey.com/r/5FYZXQG) or the ESMC linkedin channel, see posts (https://www.linkedin.com/company/esmc-dresden/?viewAsMember=true).
After reviewing submissions, ESMC is going to contact all companies who submitted their service profile by the end of August 2026. Stay tuned!
Following the registration period, ESMC will review all submitted company profiles and contact applicants by the end of August 2026 regarding the next steps.
The initiative represents another important milestone in building a resilient and competitive European semiconductor supply chain while creating new business opportunities for companies across the continent.
The European Semiconductor Manufacturing Company (ESMC) is a joint venture between TSMC, Bosch, Infineon and NXP to establish a state-of-the-art semiconductor fabrication facility in Dresden, Germany. The project will significantly strengthen Europe’s semiconductor manufacturing capabilities and support key industries such as automotive, industrial electronics, IoT and telecommunications.
With advanced 28/22 nm planar CMOS and 16/12 nm FinFET process technologies, the facility will play a crucial role in enhancing Europe’s technological sovereignty and driving innovation across the European semiconductor ecosystem.