STIP – Technical Meeting

In October, the project “STIP – Secured Trustworthy IoT Platform” kicked off. Funded by the FFG.

For this, on 6th of February, an internal meeting took place, where technical aspects were discussed and the details were filed.

Project description                

Today, there are several limiting factors of successful IoT solutions such as inadequate security protection, limited customer demand, marketplace fragmentation or the diversity of standards and technology barriers. The Secured Trustworthy IoT Platform (STIP) addresses these challenges by focusing on HW security and identification using a scalable and open framework (firmware, application) in order to address market place demands for Industry 4.0, Industrial Automation or Predictive Maintenance applications. The consortium is built up to cover the whole supply chain from HW manufacturer (NXP,TUG) to gateway-implementation (CISC, TUG) to an IoT-integrator (IOT40) and leads to the front-end-provider (trinitec) as the last part in the chain. The STIP partner Silicon Alps Cluster (SAC) has at its disposal a network of actually over 112 partners covering the entire value chain of electronic based systems in Austria.

Key objectives of the STIP project

Sensor Node Layer: NXP and TUG will design and implement a product personalization process and secure key management system as well as the supportive tools. This ensures that the product personalization process can be operated by the product management without the support of developers. The results are evaluated in a proof-of-concept implementation.

Data Access Layer: The focus will be secured communication between the connected nodes and the cloud system via the gateway. It will be designed as a sub-system reference design software package (SW building blocks). CISC and TUG will implement a generic interface method for secure remote maintenance. The aim of comprehensive dependability is to provide a seamless argumentation that the developed system has achieved a certain level of maturity and can be justifiably trusted.

Business Logic (BL) Layer: The system will anticipatoryact on critical situations in real-time normally not covered or envisioned by standard rule sets developed by domain experts. Automatic actions will comprise alarms, warnings, configurations/re-configurations of devices (also sensors) and predictive maintenance issues.

Presentation Layer: trinitec will advance this solution approach by a generic and adaptive data model, tailored information design and incremental machine learning.

The Open Innovation approach allows businesses to transcend these company boundaries, to incorporate external technologies into idea development processes, and to use external expertise to tap into alternative markets. By involving other businesses, we can ensure that potential synergy effects can be put to best use.