Smart Systems and Systems Integration


Dr. Oana Mitrea
mobile +43 664 88 22 62 52
phone +43 4242 42 416

The Smart Systems & Systems Integration Group builds the foundation for cooperation and innovation in the field of Electronics Components and Systems

The Smart Systems and Systems Integration cluster focus group was founded in 2018. It comprises of experts from science and industry representing a variety of foundational technology layers (process technologies, equipment, materials and manufacturing, components, modules and systems integration, embedded software) and cross-sectional technologies (such as artificial intelligence, edge computing and advanced control, connectivity, architecture and design, methods and tools,  reliability testing) for a variety of application fields: smart production, health, mobility.

The group is divided in sub-teams addressing focal points selected and evaluated annually. There are currently three teams coping with: Green electronics, Condition Monitoring and Predictive Maintenance and Interconnect Technologies in System Integration. They meet regularly (each second months) to learn from each other, discuss challenges and use cases, and initiate project cooperation.


The expert group represents the Silicon Alps bundled reference for the initiation and implementation of innovation in the field of smart systems and sytems integration

The group informs about existing competences, spreads best practices and experiences, provides answers and expertise to challenges s and inititeds project cooperations.


Electronic components and systems as seen as key building blocks for a more sustainable and competitive society and economy. In Europe they are already part of the countermeasures to global challenges such as the acceleration of climate change, pandemic threats, threats to privacy and democracy, social inequality.

Electronic and micro-electronic systems are based on different components and sub-components that need to be integrated into one higher level system, which in the aggregate provides the overarching function. This aspect of system integration became a key enabler of modern consumer as well as industrial products that exhibit high functional density at affordable cost. These capabilities are a result of past and continuous ongoing R&D efforts of corporate, academia and RTO’s.

South Austria does feature a high density of competences in the smart systems and system integration related fields. The list of milestones to be reached by 2030 in the European ECS Roadmap (ECS-SRIA 2021) highlights the need to set ambitious goals for collaborative projects, to whcih we aim to align. Our vision is to make the Silicon Alps region a hot-spot for joint innovation in smart systems and systems integration, respective to industril competitiveness, sustainability, digital age and European sovereignty.


Strategic Cooperation between Silicon Alps and EPoSS ‚Äď the European Technology Platform on Smart Systems Integration (MoU signed on 18th. May 2021)


The mission of our group is to make the existing expertise known (widespread) and bring it action in the form of cooperation and innovation.

The declared goals are: to inform the EBS ecosystem about detailed competences, to identify use cases and topics for innovative cooperation, which have potential for high competitiveness on the global scene and to initiate cooperation in projects in this field.


Fields of Action

Fields of Action

  • Identification of topics with potential for cooperative innovations in online innovation meetings
  • Highlight of relevant calls and calls for participation
  • Silicon Alps Special Prizes “Smart Systems”¬†

Building on trends and in alignment with the European ECS Roadmap (ECS-SRIA 2021) we currently explore the innovation potential of the following topics:


Finding the right assembly and interconnection technologies for system integration
Green and Sustainable Electronics Based Systems
Predictive Maintenance: Variety of Approaches and Technologies




We regularly conduct online workshops to explore the innovation potential in these fields, based on concrete use cases and their challenges.

If you are interested to take part in these CFG workshops, please contact

We are looking forward to the cooperation!

Core Research Competences at the hardware level

Material design, modelling and simulation 

 The development, modeling and simulation of advanced materials forms the base of the value chain for semiconductor process technologies, packaging and manufacturing technology as well as for the integration of individual components into complex electronic systems. 

The cluster focus group covers a broad range of material related research challenges, including ongoing miniaturization, heterogeneous integration, rising demands on performance and operational conditions as well as circular resource usage, waste minimization and enhancing the resource efficiency of electronic based systems.  

We address these challenges by application-focused material design and process development, combined with systematic experimental investigations and advanced simulation and modeling tools covering mechanical, thermal and electrical evaluations, crack growth as well as reliability-related questions involving semiconductors, metals, ceramics, polymers as well as composite materials. 

 System integration processes 

 Advanced heterogeneous integration and packaging solutions for 3D stacking, System in Package SiP, sensor integration, photonics, power electronics, in general high functionality in miniaturized space rely heavily on mastering system integration processes. We address major challenges with wafer- and die- level integration of devices with evolving interconnect technologies and materials (back-end processes, assembly processes). Among the expertise in material deposition processes a strong emphasis is made on novel additive manufacturing processes offering flexibility in R&D and freedom of design of a digital, maskless technology.  Wherever necessary process development is supported by simulation and optimization competences with FEM and material characterization.  

  • ¬†waferlevel¬†integration¬†¬†
  • interconnect processes¬†
  • additive manufacturing¬†¬†
  • process simulation¬†and optimization¬†

 Characterisation & Reliability 

Smart Electronic Components and Systems (ECS) are highly complex multiphysics and multiscale systems that range from the millimeter to the nanometer length scale. Smart ECS must function reliably under complex combinations of environmental influences in the life cycle and operating loads. To ensure reliable operation and high availability, a systematic co-design is required that combines electrical, mechanical, thermal, and chemical analysis to focus on performance, design on manufacturability, testability, and reliability. Designing higher performing, longer-lasting and predictable materials and systems will also result in less material usage and a lower lifecycle carbon footprint. The CFG aims at these challenges by offering the relevant knowledge that combines reliability physics & analytics as well as artificial intelligence (based on data analytical machine learning algorithms). 

  • material characterization and testing¬†
  • aging,¬†reliability and media resistance¬†
  • material compatibility evaluation ¬†

Integrated Systems and Circuits 

 Integrated circuits (IC’s) are key enabling technologies in shrinking large electronic systems into mobile hand-held devices and has been a main technology driver for electronic innovation over the past decades. The shrinking of IC technologies down to 5nm allows always smarter, more reliable and most efficient electronics applications. Due to the enormous complexity of integrated systems (Systems-on-Chip / SoC), not only new IC technologies have to be developed, but also new challenges in the design of integrated circuits and heterogeneous integration (System-in-Package / SiP) have to be faced.  

The cluster focus group provides knowledge among these challenges like  

  • Modelling of electronic systems on different levels of abstraction¬†
  • System level verification¬†¬†
  • Modelling of failure mechanisms and circuit degradation on¬†device and¬†system level¬†
  • System-on-Chip design automation¬†
  • Design of¬†analog¬†and digital electronic circuits¬†
  • High frequency circuits for communication¬†Integrated sensor electronic frontends¬†Co-design of integrated circuits with heterogeneous integration technologies¬†

Core Research Competences at the software level



Workshops on system integration specialist topics and application examples:
E.g. green electronics, connection technologies in system integration, condition monitoring & predictive maintenance

Presentation of use cases and identification of cooperation topics
Competence push / application pull

Competence map of the scientific partners
Info Brochure – Download
In planning: Detailed interactive map (MindMap) with search function for cluster members

Member companies

Contact if you want to be part of the group